Power chips are attached to outside circuits with product packaging, and their performance depends on the support of the packaging. In high-power scenarios, power chips are typically packaged as power modules. Chip affiliation describes the electric link on the upper surface area of the chip, which is generally aluminum bonding wire in standard modules. ^
Traditional power module package cross-section

Currently, business silicon carbide power components still mostly use the product packaging innovation of this wire-bonded standard silicon IGBT module. They deal with issues such as large high-frequency parasitical criteria, insufficient warm dissipation ability, low-temperature resistance, and insufficient insulation strength, which limit using silicon carbide semiconductors. The display of excellent efficiency. In order to address these problems and totally manipulate the significant possible advantages of silicon carbide chips, several brand-new packaging modern technologies and remedies for silicon carbide power components have emerged in the last few years.

Silicon carbide power component bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually developed from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have developed from gold wires to copper cables, and the driving force is expense reduction; high-power tools have established from aluminum wires (strips) to Cu Clips, and the driving force is to improve product performance. The better the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared with conventional bonding packaging approaches, Cu Clip technology has the complying with benefits:

1. The link between the chip and the pins is made from copper sheets, which, to a certain level, changes the basic wire bonding technique between the chip and the pins. As a result, a special plan resistance worth, higher current flow, and better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can totally save the price of silver plating and poor silver plating.

3. The product appearance is completely regular with normal products and is mostly utilized in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other fields.

Cu Clip has two bonding techniques.

All copper sheet bonding technique

Both eviction pad and the Source pad are clip-based. This bonding technique is more costly and intricate, however it can achieve better Rdson and better thermal results.

( copper strip)

Copper sheet plus cord bonding approach

The resource pad utilizes a Clip technique, and the Gate makes use of a Cord method. This bonding approach is somewhat less costly than the all-copper bonding technique, saving wafer location (applicable to extremely little entrance areas). The procedure is simpler than the all-copper bonding technique and can get much better Rdson and much better thermal effect.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper connection, please feel free to contact us and send an inquiry.

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