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Application of molybdenum silicide

wallpapers Tech 2020-07-07
Molybdenum Disilicide (MoSi2) is a molybdenum silicon compound, also known as molybdenum disilicide. Molybdenum silicide has a high melting point, low density, good thermal conductivity and good electrical conductivity, as well as excellent high-temperature oxidation resistance and high Elastic modulus, low thermal expansion coefficient, high strength, chemical corrosion resistance and excellent thermal shock resistance are widely used in high-temperature heating element materials and high-temperature oxidation-resistant coating materials, and are also high-temperature structural materials with excellent development potential And wear-resistant materials.

Molybdenum silicide has a high melting point of 2030 ℃; the use temperature can reach 1625 ℃. Molybdenum silicide can oxidize when the heat is more top than 800 ℃. A layer of thick, continuous thin glass of silicon oxide with self-healing ability is formed on the surface, isolating the further contact between oxygen and molybdenum silicide Further oxidation, due to the high-temperature fluidity of the glass coating, it can also fill the cracks caused by thermal stress and the voids created by bubbles, so it has excellent resistance to high-temperature oxidation. Studies have shown that its high-temperature oxidation resistance can reach 1700 ℃. Existing molybdenum silicide coatings still have some disadvantages, mainly in the low-temperature range, molybdenum silicide will accelerate the oxidation problem, the oxidation product is MoO3 whiskers with instability at high temperature, resulting in the fracture of the silicon oxide layer And loosening, cracking and powdering the oxidation protection layer of molybdenum silicide, and nano-molybdenum silicide can solve this shortcoming.

Trunanao is one of the world's largest molybdenum disilicide manufacturers. The company has various particle sizes of molybdenum disilicide, and can also customize product specifications. If necessary, please contact Dr. Leo, email: brad@ihpa.net.

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